100% material declaration data sheet FFG323 pk235 (v1.0) december 12, 2007 material declaration data sheet average weight: 2.8477 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.000010 0.000% silicon 7440-21-3 100.00 0.000010 solder bump 0.016860 0.592% tin 7440-31-5 63.00 0.010622 lead 7439-92-1 37.00 0.006238 underfill 0.056000 1.966% silica 60676-86-0 70.00 0.039200 epoxy resin a 9003-36-5 20.00 0.011200 epoxy resin b 25068-38-6 3.00 0.001680 hardener 19900-65-3 7.00 0.003920 heat spreader 1.100000 38.627% copper 7440-50-8 99.60 1.095600 nickel 7440-02-0 0.40 0.004400 heat spreader adhesive 0.031000 1.089% organopolysiloxane mixture n/a 100.00 0.031000 substrate 1.343877 47.191% copper 7440-50-8 47.61 metal layer 0.639826 nickel 7440-02-0 0.51 metal layer 0.006854 gold 7440-57-5 0.11 metal layer 0.001478 glass fiber n/a 10.35 0.139093 halogen fire retardant n/a 5.25 0.070500 bt (core) n/a 27.54 0.370148 solder mask n/a 8.63 0.115978 solder balls 0.300000 10.535% tin 7440-31-5 95.50 0.286500 silver 7440-22-4 4.00 0.012000 copper 7440-50-8 0.50 0.001500 pk235 (v1.0) december 12, 2007 www.xilinx.com 1 ? 2007 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? FFG323 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 12/12/07 1.0 initial release. pk235 (v1.0) december 12, 2007
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